Solder Paste for Low Peak Temperature (230℃)


LFM-48Type4 PZV

Solder Paste for Low Peak Temperature (230℃)
 
This product is excellent in meltability at low peak temperature (230℃) and is effective in improving void suppression and wettability. Improves solderability for low heat-resistant parts, etc; and is also excellent in printability, enabling high-speed printing and reduced frequency of cleaning.
 
 

Feature 1: Excellent meltability at low peak temperature (230℃)


 

Feature 2:Reduces voids at low peak temperature (230℃)


 

Feature 3: Excellent wettability for metals


 

Feature 4:Excellent printability. High-speed printing and consecutive printing (reduced cleaning frequency) are possible.

 

Feature 5:Possible to solder under the peak temperature equivalent to SAC305 in spite of low silver composition.


 
Solder Paste Products Specifications
 

Flux Name Alloy Name Alloy Composition Particle name:Particle Size Melting Point Flux Content Viscosity
PZV LFM-48 Sn-3.0Ag-0.5Cu

Type4:20-38μm

217-220℃   11.8% 200Pa・s
SJM-03 Sn-0.3Ag-0.7Cu-2.0Bi-α W:20-38μm 210-225℃

*SJM-03S is patented in Japan (JP PAT No.3966554) and in the United States (US PAT No.7138086B2).
 
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