Solder Paste for Low Peak Temperature (230℃)
This product is excellent in meltability at low peak temperature (230℃) and is effective in improving void suppression and wettability. Improves solderability for low heat-resistant parts, etc; and is also excellent in printability, enabling high-speed printing and reduced frequency of cleaning.
Feature 1： Excellent meltability at low peak temperature (230℃)
Feature 2：Reduces voids at low peak temperature (230℃)
Feature 3： Excellent wettability for metals
Feature 4：Excellent printability. High-speed printing and consecutive printing (reduced cleaning frequency) are possible.
Feature 5：Possible to solder under the peak temperature equivalent to SAC305 in spite of low silver composition.
Solder Paste Products Specifications
|Flux Name||Alloy Name||Alloy Composition||Particle name：Particle Size||Melting Point||Flux Content||Viscosity|