Core Solder for Through-hole Soldering


SR-HS

Core Solder for Through-hole Soldering
 
This product is the best for linear soldering for multiple pins and spot soldering for through holes.
Enables stable high-speed soldering.
 
 

Feature (1) Stable high-speed linear soldering


 

Feature (2) This product ensures stable wetting on the back in soldering substrate through holes.


 

Feature (3) This product achieves stable spread of flux residue to prevent interference from flux residue in the areas to be soldered.

Photos of Substrate (the soldered side) after linear soldering

Flux Name Alloy Name
(Alloy Composition)
Melting Point Flux Content Wire Diameter (mm)
SR-HS LFM-48M
(Sn-3.0Ag-0.5Cu-α)
217- 221℃

3.5%、4.5%

0.3、0.38、0.5、0.65、
0.8、1.0、1.2、1.6

 
合金組成一覧へ