Solder that Prevents Deterioration of Soldering Iron Tips (Core Solders)


Solder that Prevents Deterioration of Soldering Iron Tips (Core Solders)

LFM-M/S Series
 
These products prevent deterioration of soldering iron tips, which is a major problem in Pb-free products.
They reduce the frequency of tip replacement while realizing stable soldering and cost reduction.
 
 

 
Alloy Properties

Category Core Solder that Prevents
Deterioration of Iron Tips
JEITA Alloy Test Method
Alloy Name LFM-48S/LFM-48M

LFM-48

Alloy Composition Sn-3.0Ag-0.5Cu-α Sn-3.0Ag-0.5Cu
Liquidus Temperature (℃) 221 220 DSC Test
Solidus Temperature (℃) 217 217 DSC Test
Tensile Strength (MPa) 46 44 ※JIS Tensile Test
Yield Strength (MPa) 39 38 JIS Tensile Test
Elongation (%) 47.5 48.2 JIS Tensile Test
Work Hardening Coefficient 0.032 0.040 JIS Tensile Test
Young’s Modulus (GPa) 52 50 Ultrasonography
Poisson’s Ratio 0.35 0.36 Ultrasonography
Specific Gravity 7.4 7.4 Digital Hydrometer
Specific Heat (J/g K) 0.23 0.23 Laser Flash Method
Thermal Conductivity (%) 65.9 63.2 Laser Flash Method
Thermal Expansion Rate (%) 100℃ 0.172 0.173 Vertical Dilatometer

Thermal Expansion Coefficient(10-6/K)

20-100℃ 21.6 21.6 Vertical Dilatometer

 
Core Solder that Prevents Deterioration of Iron Tips

Flux Alloy Name Alloy Composition Melting Spot Alloy Category Antioxidant Effect
All types of flux LFM-48S Sn-3.0Ag-0.5Cu-α 217-221℃ SAC305 ×
LFM-48M Sn-3.0Ag-0.5Cu-α 217-221℃ SAC305
LFM-86S Sn-3.0Ag-0.7Cu-α 217-228℃ Low Ag
SJM-03S Sn-0.3Ag-0.7Cu-2.0Bi-α 210-226℃ Low Ag + High Strength
LFM-41S Sn-0.3Ag-2.0Cu-α 217-270℃ Alloys that prevent Cu leaching
LFM-22S Sn-0.7Cu-α 227-228℃ Sn-Cu

*LFM-48S is a sublicensed product based on US PAT No.6231691B1.
*LFM-48M and SJM-03S are patented in Japan (JP PAT No.3966554) and in the United States (US PAT No.7138086B2).
 
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