High Reliability Non-Halogen Solder Paste
J-STD ROL0 Non-Halogen solder paste. Good wettability under Air Reflow Oven, less voids, stable printing deposit from 1st print.
Feature1：Minimizes voids by reducing evaporated gases during reflow soldering and improving fluidity of the flux.
Evaluation Void test
■ Reflow Condition
Feature2：Improves printability with drastic revised New Flux ingredients. Provides decent print deposit from 1st print, stable continuous printing is available.
Evaluation Continuous printability test
■ Test Condition： Print Speed：50mm/s
Snap off Speed：Constant Speed 5mm/s
Continuous printability test for 12 pieces→ Cleaning→ Then continuous printability test for 4 pieces（Total 16 pieces）
Feature3：New Non-Halogen L0 solder paste has equivalence wetting property as existing L1 products （Halogen < 0.5%）