製品情報
＞＞Products ＞＞Core SoldersPb-free
Halogen-free and Low-halogen Products
For use with “halogen-free” required applications. Far superior solderability compared to previous (and competitor’s) “halogen-free” products. Choose the product that best fits your requirements.
| Product Name | Alloy Name(alloy composition) | Flux Content | Melting Point | Characteristics | Download |
| SR-38RMA | LFM-48(Sn-3.0Ag-0.5Cu) | 2.5% | 217-220℃ | Highly reliable flux conforming to QQS-571RMA standard Handles halogen-free specifications Good initial wettability and can be applied to a wide variety of products |
PDF Download |
| 3.5% | 217-220℃ | ||||
| 4.5% | 217-220℃ | ||||
| LFM-22(Sn-0.7Cu) | 3.5% | 227℃ | |||
| LFM-41(Sn-0.3Ag-2.0Cu) | 3.5% | 217-270℃ | |||
| NHR-1 | LFM-48(Sn-3.0Ag-0.5Cu) | 3.5% | 217-220℃ | Non-halogen flux | |
| GUMMIX-19NH | LFM-48(Sn-3.0Ag-0.5Cu) | 3.5% | 217-220℃ | Non-halogen flux, reduces flux-splattering |
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| GUMMIX-21NH | LFM-48(Sn-3.0Ag-0.5Cu) | 3.5% | 217-220℃ | Non-halogen flux, reduces flux-splattering Flux residue does not crack or peel |
SR Series
Flux developed for Pb-free soldering. Good initial wettability and consistent soldering performance.
| Product Name | Alloy Name(alloy composition) | Flux Content | Melting Point | Characteristics | Download |
| SR-37 | LFM-48(Sn-3.0Ag-0.5Cu) | 3.5% | 217-220℃ | Good initial wettability Greatly improves flux splattering and smoke during soldering |
PDF Download |
| LFM-22(Sn-0.7Cu) | 3.5% | 227℃ | |||
| LFM-41(Sn-0.3Ag-2.0Cu) | 3.5% | 217-270℃ | |||
| SR-55 | LFM-48(Sn-3.0Ag-0.5Cu) | 3.5% | 217-220℃ | Improves on SR-37's initial wettability | PDF Download |
| LFM-22(Sn-0.7Cu) | 3.5% | 227℃ | |||
| SR-34Super | LFM-48(Sn-3.0Ag-0.5Cu) | 3.5% | 217-220℃ | Good initial wettability Best choice when workability is the priority. |
PDF Download |
| LFM-22(Sn-0.7Cu) | 3.5% | 227℃ | |||
| LFM-41(Sn-0.3Ag-2.0Cu) | 3.5% | 217-270℃ | |||
| SR-34 | LFM-48(Sn-3.0Ag-0.5Cu) | 3.5% | 217-220℃ | Original version of SR-34 Super | |
| LFM-22(Sn-0.7Cu) | 3.5% | 227℃ |
GUMMIX Series
Combats flux splattering and flux residue peeling. Ideal for a wide range of applications: from lenses and motors to flexible circuit boards, etc.
| Product Name | Alloy Name(alloy composition) | Flux Content | Melting Point | Characteristics | Download |
| GUMMIX-19 | LFM-48(Sn-3.0Ag-0.5Cu) | 3.5% | 217-220℃ | Original version of the GUMMIX-19 series | PDF Download |
| GUMMIX-19CH | LFM-48(Sn-3.0Ag-0.5Cu) | 3.5% | 217-220℃ | Improved workability | |
| GUMMIX-SB RMA | LFM-48(Sn-3.0Ag-0.5Cu) | 3.5% | 217-220℃ | Handles laser and soft-beam soldering | |
| GUMMIX-21 | LFM-48(Sn-3.0Ag-0.5Cu) | 3.5% | 217-220℃ | Specializes in reducing flux splattering and residue peeling or cracking. | |
| GUMMIX-71 | LFM-48(Sn-3.0Ag-0.5Cu) | 3.5% | 217-220℃ | Flux with a high melting point. Does not liquefy in environments under 100℃ |
KR-19 Series
Almit’s longest selling series. Has many achievements and can be used with lead-free applications as well.
| Product Name | Alloy Name(alloy composition) | Flux Content | Melting Point | Characteristics | Download |
| KR-19 | LFM-48(Sn-3.0Ag-0.5Cu) | 3.5% | 217-220℃ | Good solderability for Ni, SUS (301, 304, 430) | PDF Download |
| LFM-22(Sn-0.7Cu) | 3.5% | 227℃ | |||
| KR-19SH RMA | LFM-48(Sn-3.0Ag-0.5Cu) | P-3 | 217-220℃ | QQS-571RMA certified highly reliable flux | |
| P-4 | 217-220℃ |
Other Series
Products with unique flux compositions.
| Product Name | Alloy Name(alloy composition) | Flux Content | Melting Point | Characteristics | Download |
| BT-19 | LFM-48(Sn-3.0Ag-0.5Cu) | 3.5% | 217-220℃ | Highly reliable flux (RMA). Low flux splattering. | PDFDownload |
| G-14 | LFM-48(Sn-3.0Ag-0.5Cu) | 3.5% | 217-220℃ | Highly-resistant flux ideal for slide soldering. | PDFDownload |
Products that increase soldering iron tip life
These products decrease the number of soldering tips used, which greatly decreases costs.
| Product Name | Alloy Name(alloy composition) | Flux Content | Melting Point | Characteristics | Download |
| SR-37 | LFM-48S(Sn-3.0Ag-0.5Cu-α） | 3.5% | 217-221℃ | Works well with many different fluxes and alloys Greatly reduces soldering iron tip degradation, a common problem with most other Pb-Free solders. Helps to achieve lower costs and reduce slide soldering iron leaching Stabilizes the soldering performance |
PDF Download |
| LFM-22S(Sn-0.7Cu-α） | 3.5% | 227-228℃ | |||
| LFM-41S(Sn-0.3Ag-2.0Cu-α） | 3.5% | 217-271℃ | |||
| SR-38RMA | LFM-48S(Sn-3.0Ag-0.5Cu-α） | 3.5% | 217-221℃ | ||
| LFM-22S(Sn-0.7Cu-α） | 3.5% | 227-228℃ | |||
| LFM-41S(Sn-0.3Ag-2.0Cu-α） | 3.5% | 217-271℃ |
Products that combat Cu leaching
Helps to stop Cu-leaching, an issue that has become prevalent in new Pb-free applications.
| Product Name | Alloy Name(alloy composition) | Flux Content | Melting Point | Characteristics | Download |
| SR-37 | LFM-41(Sn-0.3Ag-2.0Cu) | 3.5% | 217-270℃ | Handles various types of flux Best for soldering fine copper wire for motors, coils, and speakers, etc. |
PDF Download |
| SR-38RMA | |||||
| SR-34Super |
Leaded solder
KR-19 Series
| Product Name | Alloy Name (alloy composition) |
Flux Content | Melting Point | Characteristics |
| KR-19 | 60A | 2.5% | １83-190℃ | ・RA certified to former US federal specifications ・Handles difficult-to-solder materials such as Ni and stainless steel ・Best solderability |
| 3.5% | ||||
| Pure Tin | 3.5% | 232℃ | ||
| SJ-７ | 2.5% | 179-187℃ | ||
| KR-19 RMA | Sn60 | P-2 | １83-190℃ | ・RMA certified to former US federal specifications ・No-clean product ・Best for slide soldering equipment |
| P-3 | ||||
| Sn63 | P-2 | 183℃ | ||
| P-3 | ||||
| KR-19 RMASuper Flow | Sn60 | P-2 | １83-190℃ | ・Same reliability as KR-19RMA, but improved solderability |
| KR-19 SH RMA | 60A | P-2 | １83-190℃ | ・RMA certified to former US federal specifications ・No-clean OK ・Flux residue is almost transparent ・Heat-resistant flux ・Best for slide soldering equipment ・QFP flowing solder does not need a flux applicator （P-4） |
| P-3 | ||||
| P-4 | ||||
| SJ-７ | P-2 | 179-187℃ | ||
| P-3 | ||||
| HR-19 M | Sn60 | P-2 | １83-190℃ | ・No-clean OK ・Flux has excellent high-temperature resistance. Burnt deposits and solder waste stick less. ・Good solderability for Ni, palladium, beryllium copper, etc. ・Flux residue is almost transparent ・Very low flux spattering and solder balls |
| P-3 |
GUMMIX Series
| Product Name | Alloy Name (alloy composition) |
Flux Content | Melting Point | Characteristics |
| GUMMIX-19 | Sn60 | 2.5% | １83-190℃ | ・No flux residue cracking and peeling ・Very low flux spattering and solder balls ・No-clean OK |
| GUMMIX-19 CH | 2.5% | |||
| GUMMIX SB RMA | 2.5% |
