Product
＞＞Products ＞＞Solder PastePb-free
Halogen-free (NH Series)
Non-halogen paste that is considerate to the environment
| Product Name (Flux Name) |
Alloy Name (alloy composition) |
Powder Size | Melting Point | Flux Content | Characteristics | Download |
| NH(D) | LFM-48(Sn-3.0Ag-0.5Cu） | X：(25-45μm） | 217-220℃ | 11.5% | Non-halogen paste Superior melting and wetting ability Not for fine powder sizes |
PDF Download |
| W：(20-38μm） | ||||||
| U：(10-28μm） | ||||||
| NH | X：(25-45μm） | 12.0% | Non-halogen paste | |||
| W：(20-38μm） | ||||||
| NH(A) | X：(25-45μm） | 11.0% | Non-halogen paste | |||
| W：(20-38μm） |
SUC Series
Provides stable, continuous printing.
Good wetting on difficult parts, even in air reflow soldering.
| Product Name (Flux Name) |
Alloy Name (alloy composition) |
Powder Size | Melting Point | Flux Content | Characteristics | Download |
| SUC | LFM-48(Sn-3.0Ag-0.5Cu） | W：(20-38μm） | 217-220℃ | 11.5% | Stable performance during continuous printing Enhanced wettability in air reflow soldering |
PDFDownload |
| U：(10-28μm） |
Anti-Flux Spattering Products
Flux splattering greatly decreased during reflow. Best suited for dealing with flux splattering problems near the point of contact.
| Product Name (Flux Name) |
Alloy Name (alloy composition) |
Powder Size | Melting Point | Flux Content | Characteristics | Download |
| PMK | LFM-48(Sn-3.0Ag-0.5Cu） | X：(25-45μm） | 217-220℃ | 11.5% | Decreases flux splattering Greatly improves wettability |
PDF Download |
| W：(20-38μm） | ||||||
| SPM | X：(25-45μm） | 11.0% | Counters flux splattering | |||
| W：(20-38μm） |
TM-HP Series
Fluxes able to withstand high-temperature pre-heats - Almit's best seller.
| Product Name (Flux Name) |
Alloy Name (alloy composition) |
Powder Size | Melting Point | Flux Content | Characteristics | Download |
| TM-HP | LFM-48(Sn-3.0Ag-0.5Cu） | X：(25-45μm） | 217-220℃ | 12.0% | Withstands high temperature pre-heating Improves BGA wettability |
PDF Download |
| W：(20-38μm） | ||||||
| U：(10-28μm） | ||||||
| TM-TS | X：（25-45μm） | 11.5% | Good printability Good ICT testability |
|||
| W：(20-38μm） | ||||||
| TM | X：(25-45μm） | 11.5% | Highly reliable flux | |||
| W：(20-38μm） |
SSK Series
Deals with technically demanding printing conditions to enhance production efficiency
| Product Name (Flux Name) |
Alloy Name (alloy composition) |
Powder Size | Melting Point | Flux Content | Characteristics | Download |
| SSK-V | LFM-48(Sn-3.0Ag-0.5Cu） | X：(25-45μm） | 217-220℃ | 12.0% | Ideal printability Permits stable printing under a broad range of conditions |
PDF Download |
| W：(20-38μm） | ||||||
| U：(10-28μm） |
Laser Soldering
Flux for Laser Soldering
| Product Name (Flux Name) |
Alloy Name (alloy composition) |
Powder Size | Melting Point | Flux Content | Characteristics |
| SSI-M | LFM-48(Sn-3.0Ag-0.5Cu) | X：(25-45μm） | 217-220℃ | 13.0% | Ideal for laser soldering Low spattering even with sudden increases in temperature |
| W：(20-38μm） |
Low Melting Point Paste
Various low melting point pastes are available
| Product Name (Flux Name) |
Alloy Name (alloy composition) |
Powder Size | Melting Point | Flux Content | Characteristics | Download |
| INP | LFM-70 (Sn-3.5Ag-0.5Bi-8.0In) |
X：(25-45μm） | 194-206℃ | 11.0% | Sn-In type paste Excellent stability over time and no slumping during preheats. |
PDF Download |
| W：(20-38μm） | ||||||
| LFM-71 (Sn-3.5Ag-0.5Bi-4.0In) |
X：(25-45μm） | 205-212℃ | ||||
| W：(20-38μm） | ||||||
| IBL | LFM-52 (Sn-3.5Ag-0.5Bi-3.0In) |
X：(25-45μm） | 207-214℃ | 11.0% | ||
| W：(20-38μm） | ||||||
| MHS-32 | LFM-31 (Sn-8.0Zn-3.0Bi) |
X：(25-45μm） | 190-199℃ | 12.0% | Sn-Zn type paste Excellent stability over time |
|
| W：(20-38μm） | ||||||
| A75 | LFM-65 (Sn-58Bi) |
X：(25-45μm） | 139℃ | 12.0% | Sn-Bi type paste | |
| W：(20-38μm） |
Leaded solder
HM１－RMA Series
High reliability fluxes
| Product Name | Allow Composition | Powder Size | Melting Point | Flux Content | Characteristics |
| Sn63 HM1-RMA V14L | Sn63-Pb37 | 25-45μm | 183℃ | 9.5% | High reliability |
| Sn63 HM1-RMA V16L | 20-38μm | ||||
| Sn62 HM1-RMA V14L | Sn62-Pb36-Ag2 | 25-45μm | 179℃ | 9.5% | Combats Ag leaching |
| Sn62 HM1-RMA V16L | 20-38μm | ||||
| SJ-7 HM1-RMA V14L | Sn62-Pb34.5-Ag3-Sb0.5 | 25-45μm | 179－187℃ | 9.5% | Heat-resistant, high strength solder |
| SJ-7 HM1-RMA V16L | 20-38μm |
SSHA Series
Solders with superior wettability ideal for circuit boards with many BGA/CSP components
| Product Name | Allow Composition | Powder Size | Melting Point | Flux Content | Characteristics |
| Sn63 SSHA-S | Sn63-Pb37 | 25-45μm | 183℃ | 10.0% | Superior wettability |
| Sn62 SSHA-S | Sn62-Pb36-Ag2 | 25-45μm | 179℃ | 10.0% | Combats Ag leaching |
| SJ-7 SSHA-S | Sn62-Pb34.5-Ag3-Sb0.5 | 25-45μm | 179-187℃ | 10.0% | Heat-resistant, high strength solder |
| SJ-7 SSHA-S16 | 20-38μm | ||||
| SSHA SJ･S | Sn57-Pb38-Sb0.5-Ag1.5-Bi3 | 25-45μm | 171-181℃ | 10.0% | Handles CSP and BGA components |
| SSHA SJ･S16 | 20-38μm |
HA Series
Cleans easily
| Product Name | Allow Composition | Powder Size | Melting Point | Flux Content | Characteristics |
| Sn63 HA2-RA | Sn63-Pb37 | 25-45μm | 183℃ | 10.0% | Superior wettability Good cleanability |
