about3

History

 

1956.3.19 Company was established and successful with practical realization of alminum-use solder.
1958.2 Aluminum-use solder was selected for inclusion in the “11th Notable Inventions”by the Science and Technology Agency.
1967.4 Factory and laboratory established in Chofu-shi.
1976.8 A world first, non-chlorine high-efficient resin-core solder KR-19 was developed.
1982.6 Nihon Almit’s solder KR-19RMA was adopted for use on NASA space shuttles.
1984.4 First research lab opened in Akiruno-shi, Tokyo.
1984.4.12 Awarded the 36th Mainichi Industiral Techology Award
1985.1 Awarded the Tokyo Merit Award
1985.2 Awarded the Tanabe Invention Merit Award
1985.11 Awarded VEC the 10th anniversary Outstanding R&D Award
1986.4 Awarded the Science and Technology Promotion Award
1987.2 Attended the U.S.Marine soldering seminar
1992.5 Micro Joint Laboratories established in Akiruno-shi.
1995 New headquarters building completed in Yayoi-cho, Nakano-ku.
1997 Production Technology Center established in Uenohara, Yamanashi.
2001 Production Technology Center #2 Production Management Building completed.
2001.9 Nihon Almit (all companies) acquired ISO 9001 Quality Management Systems certification.
2003.3 Nihon Almit & Micro Joint Laboratories acquired ISO 14001 Environmental Management Systems certification.
2003.11 The presiden Tsuneo Sawamura received The Order of the Rising Sun, Gold Rays with Rosette
2005.1 Shanghai Almit was established.
2008.5 Almit Thailand was established.
2008.11 Tsuneo Sawamura became CEO, and Makoto Sawamura became the president
2021.1 Released Boost Up Standard series
2023.11 100% recycled tin solder(R series) got certified to UL2809
2024.10 Makoto Sawamura became CEO, and Kenji Mukai became the president