3rd and 4th “Boost Up Standard” Series Has Been Announced at Nepcon Japan 2024

The 3rd “Boost Up Standard” series, non-halogen solder paste , and the 4th “Boost Up Standard” series, high performance holegen-free cored solder has been announced at Nepcon Japan 2024. Please ask our sales representatives for further information.
 

The 3rd Boost Up Standard:

Dual Boost solder paste
NH-GE(H) maintain high reliability as non-halogen solder paste, and application of “Dual Boost technology” which has been receiving favorable reveiws with Boost Up Standard series 1st , allows to maintain high wettability.
Application of “Dual Boost technology ” in witch 2 activators of “Boost 1”,the fast–acting activator and “Boost 2”, the slow-acting activator allow to perform coalescence and wettability.
maintains high electric insulation and reliability under tough environment, such as at bottom electrode where solvent are hard to volatilize, and high temperature environment.
The activator with “Dual Boost technology” is designed to be capable for long pre-heating and air-reflow to reduce graping phenomenon. The activator is capable for small dots to reduce head-in-pillow phenomenon on BGAs as well. Long lasting wettability discharges solder void as its most.
 

The 4th Boost Up Standard:

High performance cored solder
Confirmed to the specification of J-STD-004C ROL0, maintains high capability on through-holes, and prevents solder spikes.
Through-holes were subjected for conventional cored solders with the specification confirming to J-STD-004C ROL0, yet performs well on through-holes, and capable to be used on soldering robots.
Solder spikes were also subjected on conventional cored solders, yet reduces occurrence of solder spikes which allows solder tips to be cleaned less time.