Almit participates in Internepcon Japan 2025

Almit will participate in Internepcon Japan 2025 held during January 22nd to 24th, 2025.
We will be waiting your visit with exibitions including Boost Up Standard series and more for different application.
 
 
Exibition information
Location: Tokyo Big Sight E3-8(as soon as the East 1 entrance)

 

The 1st Boost Up Standard series: ＜DB1-RMA＞

Application of new technology “Dual Boost” which fast-acting and slow acting activators work for initial wetting and wettability on through-holes.
The solder instantly flows into the through-hole by the effect of fast acting activator, and slow acting activator provides both great wettability and workability.
Enough wetting for even oxidized substrate with a large heat capacity is ensured.

 

The 2nd Boost Up Standard series: ＜QB-1＞

Application of new technology “Quick Boost” allows instant wetting for the purpose of high spped works.
Stable solderbility at high speed soldering contributes to higher productivity.

 

The 3rd Boost Up Standard: Dual Boost solder paste ＜LFM-48 NH-GE(H)＞

NH-GE(H) maintain high reliability as non-halogen solder paste, and application of Dual Boost system which has been popular with Boost Up Standard series 1st DB1-RMA, allows to maintain high wettability.
Application of “Dual Boost technology ” witch 2 activators of “Boost 1”,the fast –acting activator and “Boost 2”,the slow-acting activator, allows to perform coalescence and wettability.
NH-GE(H) maintains high electric insulation and reliability under tough environment, such as at bottom electrode where solvent are hard to volatilize, and high temperature environment.
 

The 4th Boost Up Standard: High performance cored solder

Confirm to the specification of J-STD-004C ROL0, maintains high capability on through-holes, and prevents solder spikes.
Through-holes were subjected for conventional cored solders with the specification confirming to J-STD-004C ROL0, yet DB-ZERO performs well on through-holes, and capable to be used on soldering robots.
Solder spikes were also subjected on conventional cored solders, yet reduces occurrence of solder spikes which allows solder tips to be cleaned less time.