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2019.1.16〜18　Almit participates in Internepcon Japan 2019

Friday October 26th, 2018

Categories: news

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← 2018.2.27〜3.1　Almit participates in IPX APEX EXPO 2018 US(San Diego)

2020.1.15～17　Almit participates in Internepcon Japan 2020 →

New And Major Product Information

DB-ZERO
LFM-48 NH-GE（H）
NEW　BOOST UP ALMIT STANDARD
Solder Paste for High Aspect Ratio Printing
Solder Pastes for Laser Soldering
Solders Containing Antioxidant
Solder that Prevents Deterioration of Soldering Iron Tips (Core Solders)
Halogen-free

Core Solders

【Pb-free 】Cored Solders
【Leaded】 Cored Solders

Solder Pastes

【Pb-free】Solder Pastes (For Dispensing)
【Pb-free】Solder Pastes
【Leaded】Solder Pastes

Other Products

Solder Bars & Wires（Solid Solder）
Flux
Aluminum-use Solders

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NIHON ALMIT CO.,LTD.

2-14-2 Yayoi-cho, Nakano-ku, Tokyo 164-8666 Japan

Phone:+81-3-3379-2277

E-mail:tokyo2@almit.co.jp

Website:https://www.almit.co.jp/

© 2016 NIHON ALMIT CO.,LTD. All Rights Reserved