QB-1 LFM-48M Features of QB-1 ・New technology「Quick Boost」provides an immediate effect bringing the activate force to the activation peak quickly. ・Contributes to improvement of work efficiency with quick wet-spreading. (Good for quick drag soldering) ・JIS-A Grade Flux Reliability. ・Adjustment of flux design (Rosin Formulation) contributes to less scattering.
DB1-RMA LFM-48 Features of DB1-RMA ・Great Wettability to Through-holes by「Dual Boost」 ・Good for Oxidated Substrate after Reflow Soldering ・Prevents Flux Scattering ・Flux Reliability RMA・JIS-AA Grade・J-STD-ROL1 Effect of Technology『Dual Boost』 Figure of Activation Time New Technology『Dual Boost』
LFM-48 MR-NH Low viscosity(110Pa・s) design provides the great printing performance with the solder paste. The solder paste makes it possible to have stable printing for 0201(inch) chip apertures by type4(powder size) and 150μm stencil. Feature① Stable printability for 0201 chip parts by 150μm stencil. Test ： Printing Test Compare the variation of printing volume on 0201 chip area. （Printing volume ratio comparison） …
SRS-ZL High Reliability Cored Solder (J-STD-004B Standard ROL0 Product） The flux is ROL0 type meeting demands from International Automotive manufacturers. This solder improves the challenge on solderability to through holes that L0 products tend to have. This solder also has proper specifications to robot soldering. Feature① It is possible to have stable soldering to PCB with through holes. Evaluation Soldering Test to Through Holes…
SR-HS Flux Cored Solder wire for through holes Great for dragging solder process of multiple pins and point soldering through hole. High speed and stable soldering are possible. Feature① Possible to high speed and stable dragging soldering. Evaluation dragging solder test（Solder Iron temp : 360℃） Feature② Better stability of back fillet wetting up for through hole soldering. Evaluation TH soldering test (point)（Solder…
Almit got its start with the development of aluminum-use solder. Due to the steep rise in copper prices and the need to reduce weight, aluminum soldering has become popular again. However, aluminum-use solder and brazing materials require full attention in selection and usage. Please feel free to contact our salesperson with any questions. Product Name Features Major Purpose Name of Exclusive Flux T-235…
List of Flux Category Flux Name Features For flow soldering RC-15SH RMA RMA certified product, Highly reliable RC-281PF Pb free, Improves wettability For dip soldering RF-35M RMA For dip soldering, Highly reliable NHR-DFH For dip soldering, Halogen free For reflow soldering BM1-RMA-Nc High Viscosity Liquid Type, Best for BGA repair
List of Solder Bars & Wires Category Alloy Name Features SAC305 LFM-48K Contains antioxidant, For flow soldering LFM-48H Contains antioxidant, For high temperature dip soldering Sn-Cu-based LFM-22H Contains antioxidant, For high temperature dip soldering Prevents Cu leaching LFM-41H Contains antioxidant, Prevents Cu leaching LFM-59H Contains antioxidant, Prevents Cu leaching, For thin wire dip soldering LFM-62H Contains antioxidant, Prevents Cu leaching, For extremely thin wire…
List of Solder Pastes Category Alloy※ Flux Name Featuers For printing Sn63 HM1-RMA VL RMA certified product, Highly reliable, Long life without cleaning SSHA-S Exhibits excellent wettability, Best for BGA・CSP substrate HA2-RA Exhibits excellent wettability, Excellent workability after cleaning Syringe Sn63 HM1-RMA VL Highly reliable, Syringe type HA2-RA For cleaning, Syringe type *Compatible for Sn62（Ag2), 0.4Ag, and SJ-7 alloys. *Contact our salesperson for…
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