Solders Containing Antioxidant (LFM-H Series)

Antioxidant reduces dross oxidation on the surface of melted solders and solder ball spattering during dip soldering.
 
 

Feature① 　This product reduces oxidation and maintains the metallic luster of the surface of melted solders.

 

Feature②　This product significantly reduces oxidized dross.

 

Feature③ This product reduces solder ball spattering during dip soldering.

 

Alloy Name	Alloy Composition	Melting Point	Target Products		Features
			Wire Solders	Bar Solders
LFM-48H	Sn-3.0Ag-0.5Cu+α	217-220℃	○	○	SAC305
LFM-22H	Sn-0.7Cu+α	227℃	○	○	Sn-Cu系
LFM-41H	Sn-0.3Ag-2.0Cu+α	217-270℃	○	○	Alloys that prevent Cu leaching
LFM-59H	Sn-3.0Cu+α	227-312℃	○	○
LFM-62H	Sn-3.0Cu+0.5Ni+α	228-394℃	○	○