Features of DB1-RMA
・Great Wettability to Through-holes by「Dual Boost」
・Good for Oxidated Substrate after Reflow Soldering
・Prevents Flux Scattering
・Flux Reliability RMA・JIS-AA Grade・J-STD-ROL1
Effect of Technology『Dual Boost』
Figure of Activation Time New Technology『Dual Boost』
![](https://www.almit.co.jp/wp-content/uploads/2020/11/db1graph1e.jpg)
Ensures the wettability to through-holes by
making the activation effect long-acting.
making the activation effect long-acting.
It tends to causes the cases, such as taking longer soldering time to have enough wetting, insufficient wettability to through-holes or the occurrence of the defect, “bridge.”
![](https://www.almit.co.jp/wp-content/uploads/2020/11/db.jpg)
![](https://www.almit.co.jp/wp-content/uploads/2020/11/db1graph2e.jpg)
Dual boost effect gives good initial wettability, and it promotes the wettability to through-holes by the slow-acting activation.
Anti-bridge effect is also improved,
Anti-bridge effect is also improved,
![](https://www.almit.co.jp/wp-content/uploads/2020/11/db1fig2e.jpg)
![](https://www.almit.co.jp/wp-content/uploads/2020/11/db1fig3e.jpg)
![](https://www.almit.co.jp/wp-content/uploads/2020/11/db1spec_e.jpg)
![合金組成一覧へ](http://www.almit.co.jp/wp-content/uploads/2017/03/alloy_be.png)