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NEWS RELEASE

NEWS
2021/01/19
(日本語) 「Boost up almit standard」を電波新聞に掲載
2020/11/20
「Boost up almit standard」 2nd「QB-1」is announced in Dempa Shimbun Daily.
2020/11/13
「Boost up almit standard」 1st「DB1-RMA」is announced in Dempa Shimbun Daily.
2020/10/05
(日本語) 「インターネプコンジャパン 2021」 出展自粛について
2020/07/15
(Japanese)令和2年7月の豪雨による被害のお見舞いとお知らせ
2020/04/07
(Japanese)「緊急事態宣言発令」に伴う新型コロナウイルス感染拡大への当社対応について
2019/11/29
2020.2.19 Almit participates in Edo・Tokyo Waza to Techno no Yugoten Expo 2020
2019/11/29
2020.1.15~17 Almit participates in Internepcon Japan 2020
2018/10/26
2019.1.16〜18 Almit participates in Internepcon Japan 2019
2017/04/03
2018.2.27〜3.1 Almit participates in IPX APEX EXPO 2018 US(San Diego)

New And Major Product Information

  • NEW BOOST UP ALMIT STANDARD
  • Solder Paste for High Aspect Ratio Printing
  • Solder Pastes for Laser Soldering
  • Solders Containing Antioxidant
  • Solder that Prevents Deterioration of Soldering Iron Tips (Core Solders)
  • Halogen-free

Core Solders

  • 【Pb-free 】Cored Solders
  • 【Leaded】 Cored Solders

Solder Pastes

  • 【Pb-free】Solder Pastes (For Dispensing)
  • 【Pb-free】Solder Pastes
  • 【Leaded】Solder Pastes

Other Products

  • Solder Bars & Wires
  • Flux
  • Aluminum-use Solders

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CONTACT INFO

NIHON ALMIT CO.,LTD.

2-14-2 Yayoi-cho, Nakano-ku, Tokyo 164-8666 Japan

Phone:+81-3-3379-2277

E-mail:tokyo2@almit.co.jp

Website:https://www.almit.co.jp/

© 2016 NIHON ALMIT CO.,LTD. All Rights Reserved